U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips
Source: New York Times
The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. For more and to sign up click here To Return to the Main Aggregate News Page - click here Break'n Pics - Click here for Free Stock Photos
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Read the original source at New York Times